Senior Package Design Engineer

P. Chappel Associates, Inc.

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United States

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+1
United States

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Über

Our client is a global System-on-Chip innovator serving industries like AR/VR, ADAS, networking, and data storage. Headquartered in Yokohama with offices worldwide, Socionext delivers advanced semiconductor solutions through deep expertise and IP.
We are seeking a
Senior Package Design Engineer
to join our custom SOC/ASIC development client. You’ll work closely with cross-functional teams in the U.S. and overseas on high-performance package substrate design with a focus on signal/power integrity and routing.

Wünschenswerte Fähigkeiten

Routing

United States

Berufserfahrung

Embedded

Sprachkenntnisse

English

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