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Senior Package Design EngineerP. Chappel Associates, Inc. • United States
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Senior Package Design Engineer

P. Chappel Associates, Inc.
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  • US
    United States
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  • US
    United States
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À propos

Our client is a global System-on-Chip innovator serving industries like AR/VR, ADAS, networking, and data storage. Headquartered in Yokohama with offices worldwide, Socionext delivers advanced semiconductor solutions through deep expertise and IP.
We are seeking a
Senior Package Design Engineer
to join our custom SOC/ASIC development client. You’ll work closely with cross-functional teams in the U.S. and overseas on high-performance package substrate design with a focus on signal/power integrity and routing.

Compétences idéales

  • Routing
  • United States

Expérience professionnelle

  • Embedded

Compétences linguistiques

  • English
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