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Senior Package Design Engineer - High-Speed SemiconductorsTheconstructsimUnited States

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XX

Senior Package Design Engineer - High-Speed Semiconductors

Theconstructsim
  • US
    United States
  • US
    United States

Über

A leading electronics firm in Milpitas, CA, is seeking a Senior Engineer in Package Design to focus on signal and power integrity analyses. Candidates should possess 8 to 10 years of relevant experience in semiconductor packaging, with a strong background in high-performance designs and simulation tools such as HFSS and ADS. This position offers a competitive salary range of $210,000 to $240,000 annually. #J-18808-Ljbffr
  • United States

Sprachkenntnisse

  • English
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