Senior Package Design Engineer - High-Speed SemiconductorsTheconstructsim • United States

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Senior Package Design Engineer - High-Speed Semiconductors

Theconstructsim

United States

United States

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A leading electronics firm in Milpitas, CA, is seeking a Senior Engineer in Package Design to focus on signal and power integrity analyses. Candidates should possess 8 to 10 years of relevant experience in semiconductor packaging, with a strong background in high-performance designs and simulation tools such as HFSS and ADS. This position offers a competitive salary range of $210,000 to $240,000 annually. #J-18808-Ljbffr

United States

Compétences linguistiques

English

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