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Responsibilities
Development and execution of detailed test plans and compiling test & failure data.
Statistical data analysis to provide risk assessments for the product design
Research failure modes for new technologies to perform extensive FMEA (Failure Modes & Effect Analysis)
Prioritizing and completing tasks to meet deadlines
Providing design recommendations to cross-functional team to improve product reliability.
Interacting with a wide variety of individuals and teams to communicate results.
Requirements
2-6 years of experience performing reliability testing including Mechanical Stress Tests, Shock/ Drop/Vibration Testing & Environmental Tests
In depth understanding of failure Analysis analytical techniques (Optical Microscopy, X-Ray, SEM/EDS, FTIR, XPS etc)
Knowledge of JEDEC/IPC standards for semiconductor package qualifications.
Extensive experience with Silicon product level reliability qualification, associated failure modes and lifetime behavior modeling.
Extraordinary problem solving abilities.
Excellent communication & interpersonal skills to be able to provide concise summaries to senior executive team and drive in-depth discussions with cross- functional team.
Strong attention to detail, to drive architecture in the early phase of the projects.
Efficient time management skills to handle multiple projects at the same time.
Dynamic and “can do” attitude with collaborative spirit and product enthusiasm.
Bachelors in Mechanical Engineering, Electrical Engineering, Materials Science, or an equivalent field. Masters or PhD is preferred.
Experience with semiconductor packages or consumer electronics is a plus.
Type Full Time
Location Remote with a preference for candidates based in Austin, TX.
Pay Range $45-$55/hr DOE
Submit resume to jobs@OSIengineering.com
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Sprachkenntnisse
- English
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