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Sr Staff Package Design Engineer
Renesas Electronics Corporation
- United States
- United States
Über
Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip‑chip LGA, multi‑chip module with substrate or embedded die/capacitor and power device packaging.
Package technologies qualification for consumer & industrial power as well as automotive power applications.
Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
Resolve all process integration issues by ensuring all window checks are done on critical process steps.
Establish production controls and monitor to ensure there is no room for quality incidents.
Ensure smooth transition into production & implement ramp up monitor.
Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA.
Participate in packaging roadmap development & focus on execution.
Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
Establish & maintain package design rules
Qualifications
Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip‑chip LGA packaging.
Strong understanding of power SiP/modules which has a substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.
Benefits
Launch and advance your career
in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
Make a real impact
by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure.
Maximize your performance and wellbeing
in our flexible and inclusive work environment. Our people‑first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual‑use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in‑office days are Tuesday through Thursday for innovation, collaboration and continuous learning.
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Sprachkenntnisse
- English
Hinweis für Nutzer
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