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Senior RF Mechanical Engineer
- Tucson, Arizona, United States
- Tucson, Arizona, United States
Über
Date Posted:
Country:
United States of AmericaLocation:
US-AZ-TUCSON-M02 ~ 1151 E Hermans Rd ~ BLDG M02Position Role Type:
OnsiteU.S. Citizen, U.S. Person, or Immigration Status Requirements:
Active and transferable U.S. government issued security clearance is required prior to start date. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearanceSecurity Clearance Type:
DoD Clearance: SecretSecurity Clearance Status:
Ability to obtain INTERIM U.S. government issued security clearance is required prior to start dateAt Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.
The RF Mechanical Team at Raytheon is seeking a talented Senior Engineer to join our team in Tucson, AZ.
The candidate will be responsible for providing innovative design solutions for the packaging of antennas, RF Circuit Card Assemblies, radomes, and RF test equipment. The selected candidate will be expected to lead multidiscipline teams, provide technical oversight, delegate tasks, and work with the Engineering organization to establish technology roadmaps, enable modernization, and contribute to general innovation. In addition, the candidate will work with customer personnel and program leadership to define and refine requirements to validate hardware compliance. The candidate will be responsible for providing guidance, coaching, mentoring, and training to other employees across the business within the candidate’s areas of expertise.
This position is an onsite role, located in Tucson, AZ.
What You Will Do
- Small group technical oversight
- Common and mature RF product packaging development
- Serve as a technical resource to the organization
Qualifications You Must Have
- Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 5 years of prior relevant experience, to include any combination of the following:
- Experience performing design and / or analysis for the packaging of RF products (e.g. Circuit Card Assemblies, antennas, radomes, RF test equipment, harnesses and interconnects) throughout the product life cycle to include use of three dimensional (3D) Computer Aided Design (CAD) software
- Experience with the creation of Technical Data Packages (TDPs) using Geometric Dimensioning and Tolerancing (GD&T) for RF products
Qualifications We Prefer
- Master of Science (MS) in mechanical engineering or electrical engineering
- Experience serving as a Responsible Engineering Authority (REA), Control
Sprachkenntnisse
- English
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