Senior Hardware Engineer

P Chappel Associates Inc

United States

United States

Jetzt Bewerben

Über

We are seeking a Senior Hardware Engineer to design, develop, and test advanced communications hardware. In this role, you’ll lead circuit card assembly (CCA) development from concept through release, working closely with cross-functional teams to deliver high-performance, reliable, and manufacturable products. This is a hands-on role for an engineer who enjoys solving complex technical challenges and driving innovation. This position mainly involves board / circuit card design and development. Working the full product development lifecycle, will take marketing requirements, create design specifications, and develop architecture. Working with / supervising some less senior-level engineers, will perform component selection, schematic capture, PCB layout, testing, etc. Key Responsibilities Lead design and development of CCAs, including component selection, schematic capture, and PCB layout support Develop and execute test plans, simulations, and verification/validation activities Collaborate with mechanical engineering, IP developers, and system stakeholders to integrate hardware into full platforms Troubleshoot and debug hardware issues during development and production Optimize designs for performance, cost, reliability, and manufacturability Maintain clear documentation of designs, test results, and revisions Support project planning, schedules, and resource needs from requirements through product release Mentor junior engineers and promote best practices Identify and implement improvements in tools, processes, and technologies Qualifications B.S. or M.S. in Electrical Engineering or Computer Engineering 8–15 years of hardware design and development experience, including complex designs with FPGAs and microcontrollers Proficiency with schematic capture and PCB tools such as Cadence OrCAD / Allegro Experience designing high-speed digital interfaces (PCI/PCIe, USB, Ethernet) Strong understanding of analog/digital electronics, signal integrity, power design, and thermal considerations Strong troubleshooting, analytical, and communication skills Preferred Experience Experience supporting DO-254 certification across all SOI phases Familiarity with environmental testing (thermal, shock, vibration) Experience with MIL-STD-1553 and ARINC-429 Exposure to Multi-Chip Module (MCM) design

United States

Sprachkenntnisse

English

Hinweis für Nutzer

Dieses Stellenangebot stammt von einer Partnerplattform von TieTalent. Klicken Sie auf „Jetzt Bewerben“, um Ihre Bewerbung direkt auf deren Website einzureichen.

Jetzt Bewerben