Fab Engineering Director- Lithography

The Fab Engineering Director, Lithography, is responsible for leading and managing all aspects of wafer fabrication engineering, operations, and maintenance within the manufacturing site. This role ensures that fab performance meets the company's quality, cost, and delivery objectives while driving continuous improvement in yield, cycle time, equipment reliability, and operational efficiency. The Director will collaborate closely with product engineering and technology development teams to enable new product introductions, technology transfers, and process enhancements that support business growth and competitiveness.

This position is based in East Fishkill, NY and requires full-time on-site presence.

Leadership and Management:

• Lead and mentor a team of module engineers and maintenance professionals across multiple fab areas.
• Develop and execute strategies to optimize fab operations, improve yield, reduce cycle time, and lower cost per wafer.
• Build a strong culture of safety, quality, and continuous improvement across engineering and operations teams.

Operations and Maintenance Ownership:

• Ensure stable, predictable fab operations through robust process control and equipment reliability programs.
• Oversee preventive and predictive maintenance strategies to maximize equipment uptime and minimize unplanned downtime.
• Drive operational excellence through data-driven decision-making and advanced automation initiatives.

Technical Oversight:

• Partner with technology development teams to qualify new processes and integrate advanced technologies into production.
• Collaborate with product engineering to support new product introductions and resolve complex process/product interactions.
• Ensure engineering rigor in process development, qualification, and documentation to meet industry standards and customer requirements.

Quality and Compliance:

• Maintain compliance with company quality standards, regulatory requirements, and environmental health and safety guidelines.
• Lead root cause analysis and corrective actions for yield excursions, equipment failures, and quality issues.
• Champion continuous improvement initiatives focused on defect reduction and process stability.

5S, Cleanliness, and Audit Readiness:

• Implement and sustain 5S principles across all fab areas to ensure a clean, organized, and efficient work environment.
• Drive adherence to cleanliness standards critical for semiconductor manufacturing and contamination control.
• Support internal and external audits by maintaining documentation, readiness, and compliance with industry and customer requirements.

Project Management:

• Manage capital projects including equipment selection, installation, and qualification to meet capacity and technology needs.
• Oversee cross-functional teams for technology transfers and new product ramps, ensuring timelines and performance targets are achieved.

Strategic Planning:

• Develop long-term strategies for fab capacity, technology roadmap alignment, and operational risk mitigation.
• Identify opportunities for cost reduction and efficiency improvements across fab operations and maintenance.

Communication and Reporting:

• Provide regular updates to senior management on fab performance metrics and improvement initiatives.
• Facilitate strong communication between engineering, operations, maintenance, product engineering, and technology development teams.

Key Performance Indicators (KPIs):

• Yield: Achieve and sustain target wafer yield levels for all product lines; drive continuous improvement year over year.
• Cycle Time: Reduce wafer cycle time to meet or exceed corporate benchmarks; maintain focus on incremental improvement.
• Cost per Wafer: Deliver cost reduction initiatives aligned with annual business objectives.
• Equipment Uptime: Maintain equipment availability at or above 90% for critical tools.
• Audit Readiness: 100% compliance in internal and external audits with zero major findings; always maintain readiness.

Education:

• Bachelor's degree in electrical, Mechanical, Chemical, Materials Engineering, or related field.

Experience:

• 15 plus years of experience in semiconductor wafer fabrication, with at least 8 years in a leadership role.
• Proven track record in fab operations, module engineering, and maintenance management.
• Experience collaborating with technology development and product engineering teams on technology transfers and NPIs.

Skills:

• Strong leadership and organizational skills with ability to manage large, diverse teams.
• Excellent problem-solving and analytical abilities.
• Ability to thrive in a fast-paced, high-volume manufacturing environment.
• Strong commitment to safety and environmental compliance.
• Strong communication and interpersonal skills.
• Proficiency in project management tools and methodologies.
• Knowledge of semiconductor process technologies, equipment, and industry standards.

Other Requirements:

• Ability to travel domestically and internationally as needed. 

  Salary: onsemi is excited to share the base salary range for this position is $150,400 to $270,600 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package.  

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