Process Engineer: System in Package

*Overview *
Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

*Responsibilities
About the Role
We are seeking a highly motivated
System-in-Package (SiP) R&D Engineer
to lead the development of next-generation SiP modules integrated with microwave and mmWave subsystems across Keysight, serving multiple industries. This role focuses on
process development, process integration, and New Product Introduction (NPI)
, driving innovation that differentiates Keysight in emerging markets such as
6G and AI *
.

*Key Responsibilities *

• Develop and maintain package assembly processes.
• Specify, select, and qualify new equipment for advanced packaging.
• Contribute to process automation and Industry 4.0 initiatives to improve efficiency.
• Review new designs for manufacturability and provide feedback to IC and module designers.
• Absorb and understand process flows, product design, and performance requirements; lead manufacturing teams to develop new products that meet performance targets.
• Drive technical development of new SiP introductions in collaboration with upstream design teams, process/manufacturing teams, and downstream customer teams.
• Manage accelerated project schedules, communicate risks, while ensuring timely delivery.
• Maintain high yields while adhering to project timelines.

*Required Expertise *
Proven experience in some or all of the following areas:

• Design for manufacturing of electromechanical assemblies.
• Statistical process control (SPC), design of experiments (DOE), Process Failure Mode and Effects Analysis (PFMEA), Lean Manufacturing.
• High Accuracy/High Rate Thermocompression or flip-chip bonding.
• Surface Mount Technology (SMT) processes.
• Die singulation and semiconductor fabrication processes.
• Heterogeneous integration and advanced packaging techniques.
• New technology and product introduction.

*Qualifications *

• Bachelor's or Master's or Phd degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• Strong leadership, drive, and ambition to realize novel technologies.
• Excellent interpersonal and communication skills for cross-functional collaboration.

*Qualifications *
BS or MS or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields.

Professional Experience In The Following Areas Is Desired:

• III-V compound semiconductors and/or silicon technologies
• Thermal, mechanical and electrical reliability
• Technical project management, project lifecycle

Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***