Manufacturing Process Engineer

Overview:

We are seeking a highly skilled Manufacture Process Engineer to lead and optimize manufacturing processes for Printed Circuit Board Assemblies (PCBA). This role is critical in ensuring high-quality, reliable, and cost-effective production through expertise in stencil design, soldering processes, wave solder profiling, conformal coating, and secondary operations. The ideal candidate will bring deep technical knowledge, hands-on experience, and a continuous improvement mindset to advance our PCBA manufacturing capabilities.

Key Responsibilities

• Process Development & Optimization
• Design, validate, and optimize stencil designs for solder paste application.
• Develop and maintain reflow soldering profiles, including vapor phase reflow processes, to ensure robust solder joints and minimize defects.
• Establish and refine wave soldering profiles for through-hole components.
• Define and implement secondary operations including press-fit connector installation, heat sink attachment, and mechanical assembly steps.
• Develop and oversee conformal coating processes to ensure environmental protection and product reliability.
• Create and enforce rework standards for soldering, ensuring compliance with IPC and industry best practices.
• Manufacturing Support
• Provide technical leadership to production teams in troubleshooting assembly issues.
• Collaborate with design engineering to ensure manufacturability of PCB layouts and component selection.
• Drive yield improvement initiatives and root cause analysis for process-related defects.
• Lead Corrective and Preventive Action (CAPA) initiatives to eliminate recurring issues and strengthen process robustness.
• Support new product introduction (NPI) by developing scalable and repeatable assembly processes.
• Quality & Compliance
• Ensure adherence to IPC-A-610, J-STD-001, IPC-7711/7721, and other relevant industry standards.
• Maintain documentation of process parameters, work instructions, and control plans.
• Partner with quality engineering to implement corrective and preventive actions (CAPA).
• Continuous Improvement
• Lead projects focused on automation, efficiency, and cost reduction.
• Evaluate and introduce new technologies, equipment, and materials to enhance PCBA processes.
• Train and mentor junior engineers and technicians in advanced assembly techniques.

Qualifications & Experience

• Education: Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field. Master's preferred.
• Experience: Minimum 7–10 years in PCBA manufacturing engineering, with proven expertise in:
• Stencil design and solder paste application.
• Reflow soldering (including vapor phase reflow) and thermal profiling.
• Wave soldering process development and optimization.
• Conformal coating application and process control.
• Secondary operations (press-fit connectors, heat sinks, mechanical assembly).
• Rework and repair standards for solder joints.
• Root cause analysis and CAPA methodologies for troubleshooting and issue resolution.
• Strong knowledge of IPC standards (IPC-A-610, J-STD-001, IPC-7711/7721).
• Hands-on experience with SMT equipment, AOI/X-ray inspection, and process monitoring tools.
• Demonstrated success in NPI process development and scaling to volume production.
• Excellent problem-solving, analytical, and communication skills.
• Ability to lead cross-functional teams and drive process improvements in a fast-paced environment.

Preferred Skills

• Experience with Design for Manufacturability (DFM) and Design for Test (DFT) principles.
• Familiarity with Lean Manufacturing and Six Sigma methodologies.
• Proficiency in CAD tools for stencil and fixture design.
• Knowledge of advanced soldering techniques (selective soldering, laser soldering).
• Strong project management and leadership capabilities.

Pay: $90, $100,000.00 per year

Benefits:

• 401(k)
• 401(k) matching
• Dental insurance
• Health insurance
• Paid time off
• Referral program
• Vision insurance

Experience:

• Surface mount technology: 1 year (Preferred)
• IPC 610: 1 year (Preferred)

Work Location: In person