Senior Engineering Manager, Advanced Packaging and IC Technology

Date Posted:

Country:
United States of America

Location:
HIA32: Cedar Rapids, IA 400 Collins Rd NE , Cedar Rapids, IA, USA

Position Role Type:
Onsite

U.S. Citizen, U.S. Person, or Immigration Status Requirements:
The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance

Security Clearance:
DoD Clearance: Secret

Senior Engineering Manager, Advanced Packaging and IC Technology

Joining Collins Aerospace isn't just about finding a job; it's about embarking on a journey to redefine the future of aerospace technology.

Collins Aerospace, an RTX company, is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry. Collins Aerospace has the capabilities, comprehensive portfolio, and expertise to solve customers' toughest challenges and to meet the demands of a rapidly evolving global market.

Our goal is to create technologies that allow Collins to differentiate our products from the competitors' and create new market opportunities through innovation. That means we need to take risks that, if successful, could lead to large rewards. We're creating state-of-the-art microelectronics, including: secure system in package processors, 2D/2.5D/3D integrated circuit packages, and multifunction reconfigurable RF integrated circuits for communication, radar, and electronic warfare.

What You Will Do:

• Lead a team of talented engineers in research & development in microelectronics integrated circuit and secure packaging technology
• Hire engineers to complement and supplement team trajectory
• Provide technical coaching and mentoring to team members, including onboarding, development, and guidance in research and design processes
• Manage a team of 10-14 contributors, addressing performance and development, while planning and organizing team responsibilities
• Leverage advanced principles, theories, and concepts of complex technical subjects to provide direction for employees
• Actively addresses employee performance and development issues
• Apply critical thinking to solve complex problems and explore new ideas/approaches
• Lead continuous improvement projects that result in new approaches and techniques to product development
• Oversee performance of assigned project tasks (including technical, cost, schedule, design to cost, product integrity and manufacturability)
• Foster collaboration across internal and external stakeholders, including customers, subcontractors, product development teams, and program management peers.
• Collaborate with product development personnel throughout Collins and RTX to transition technology into our future product offerings
• Interfaces with external agencies, internal customers, tool vendors, and partner organizations within the company to ensure effective two-way communication of needs and results
• Development of internal and external networks, forging relationships with peers in the Program Management Team (Engineering, Business Development, and Program/Product Management.)
• Interface with engineers and value stream leaders from multiple product lines to understand technology needs
• Present technology concepts to customers/subcontractors
• Coach team members in principal investigator (PI) role for research
• Recommend projects for independent research & development (IR&D) investments
• Lead team members through pursuit & order capture activities for externally-funded R&D
• Maintains awareness of technology within the domains of integrated circuits and microelectronics packaging
• Translate processor & RF/analog integrated circuit component performance to impact on system performance
• Up to 15% travel to domestic and internationally

Qualifications You Must Have:

• Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and minimum 10 years prior relevant experience or an Advanced Degree in a related field and minimum 7 years of experience
• The ability to obtain and maintain a U.S. government issued secret security clearance is required
• Familiarity with US Government bidding process
• Experience in generating test plans, leading verification campaigns, writing test reports, and briefing customers
• Demonstrated ability to work in a creative, as well as practical problem-solving environment
• Demonstrated ability to troubleshoot problems while integrating components or subassemblies
• Demonstrated problem-solving skills, and data-driven decision-making
• Experience with peer review component/system requirements
• Experience in identifying, communicating, and mitigating risks

Qualifications We Prefer:

• Passion for challenging and developing people
• Customer focused
• Must be able to complete meaningful work in the absence of complete specifications and help create component requirements as a work in progress
• Excellent verbal/written communication and teamwork skills
• Demonstrated technical knowledge/expertise in multiple technologies
• Knowledgeable of industry trends within his/her domain
• Experience in organic and ceramic microelectronics packaging and thermal analysis/cooling approaches
• Experience in design and test of RF/microwave/millimeter or analog mixed signal integrated circuits
• Bid & proposal resulting in successful capture of funding
• Experience with environmental effects testing
• Understanding earned value management, prior cost