Dieses Stellenangebot ist nicht mehr verfügbar

Senior Packaging Design Architect – Substrate & Layout

Intel

Fort Collins, Colorado, United States

Fort Collins, Colorado, United States

Über

Intel is seeking an experienced engineer for substrate design in Fort Collins, Colorado. This position involves end-to-end development, including layout implementation and collaboration with silicon teams to optimize performance. The ideal candidate will have strong analytical skills, a Ph.D. or master's degree, and considerable experience in the semiconductor industry. Competitive salary and comprehensive benefits are offered. The role requires on-site presence and is located in a vibrant tech environment.
#J-18808-Ljbffr

Fort Collins, Colorado, United States

Sprachkenntnisse

English

Hinweis für Nutzer

Dieses Stellenangebot wurde von einem unserer Partner veröffentlicht. Sie können das Originalangebot einsehen hier.