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Senior Packaging Design Architect – Substrate & Layout

Intel
  • US
    Fort Collins, Colorado, United States
  • US
    Fort Collins, Colorado, United States

À propos

Intel is seeking an experienced engineer for substrate design in Fort Collins, Colorado. This position involves end-to-end development, including layout implementation and collaboration with silicon teams to optimize performance. The ideal candidate will have strong analytical skills, a Ph.D. or master's degree, and considerable experience in the semiconductor industry. Competitive salary and comprehensive benefits are offered. The role requires on-site presence and is located in a vibrant tech environment.
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  • Fort Collins, Colorado, United States

Compétences linguistiques

  • English
Avis aux utilisateurs

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