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Senior Packaging Design Engineer (Interposer & 2.5D/3D)MIcro-Precision Technologies • Florida, New York, United States
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Senior Packaging Design Engineer (Interposer & 2.5D/3D)

MIcro-Precision Technologies
  • US
    Florida, New York, United States
  • US
    Florida, New York, United States
Postuler Maintenant

À propos

Micro-Precision Technologies is seeking a skilled and experienced semiconductor packaging designer to lead the design of advanced semiconductor packages. This role requires 8 to 10 years of experience and proficiency in tools like Allegro Package Designer Plus, as well as a strong background in both Signal and Power Integrity analysis. The successful candidate will collaborate with cross-functional teams, optimizing layouts and conducting simulations in a dynamic environment. A Bachelor's degree in Electrical or Mechanical Engineering is required.
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  • Florida, New York, United States

Compétences linguistiques

  • English
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