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Senior Packaging Design Engineer (Interposer & 2.5D/3D)

MIcro-Precision Technologies

Florida, New York, United States

Florida, New York, United States

About

Micro-Precision Technologies is seeking a skilled and experienced semiconductor packaging designer to lead the design of advanced semiconductor packages. This role requires 8 to 10 years of experience and proficiency in tools like Allegro Package Designer Plus, as well as a strong background in both Signal and Power Integrity analysis. The successful candidate will collaborate with cross-functional teams, optimizing layouts and conducting simulations in a dynamic environment. A Bachelor's degree in Electrical or Mechanical Engineering is required.
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Florida, New York, United States

Languages

English

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