REGISTRIEREN
Zurück zur Stellenangebote
XX
IC Package Design Engineer – High-Speed & RFNutanix • Cambridge, Massachusetts, United States
Jetzt Bewerben
XX

IC Package Design Engineer – High-Speed & RF

Nutanix
  • US
    Cambridge, Massachusetts, United States
  • US
    Cambridge, Massachusetts, United States
Jetzt Bewerben

Über

Qualcomm is seeking an IC Package Design Engineer to join the Central Hardware Systems Team in Cambridge, Massachusetts. This role focuses on package design and optimization while collaborating with various teams to improve product performance. Applicants should have a Bachelor's degree in a related field, with experience in package design. Additional qualifications preferred include a Master's or PhD in relevant engineering fields. This position offers a robust benefits package including bonuses and relocation support.
#J-18808-Ljbffr
  • Cambridge, Massachusetts, United States

Sprachkenntnisse

  • English
Hinweis für Nutzer

Dieses Stellenangebot stammt von einer Partnerplattform von TieTalent. Klick auf „Jetzt Bewerben”, um deine Bewerbung direkt auf deren Website einzureichen.

Jetzt Bewerben