ADCE Packaging Design Architect

Intel

Fort Collins, Colorado, United States

Fort Collins, Colorado, United States

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Über

Job Description Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design. Completes documentation and collateral into the product lifecycle management system of record.
Required Skills and Experience
Self-motivated engineer who has strong technical background in design and electrical analysis.
Solid background in semiconductor fabrication and packaging.
Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions. – Ability to work independently and at various levels of abstraction.
Strong organization, time management, and communication skills, self-motivated.
Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.
Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
Experience and knowledge with assembly process, test and characterization techniques preferred.
Qualifications
Ph.D./master’s in electrical engineering/ chemical engineering/ mechanical engineering or Material Science.
10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.
Job Type Experienced Hire
Shift Shift 1 (United States of America)
Primary Location US, Arizona, Phoenix
Additional Locations US, California, Folsom; US, California, Santa Clara; US, Colorado, Fort Collins; US, Massachusetts, Beaver Brook; US, New Mexico, Albuquerque; US, Oregon, Hillsboro; US, Texas, Austin; US, Washington, Multiple Cities
Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003
Salary Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USD
Work Model This role will require an on-site presence.
Application Notes Job posting details (such as work model, location or time type) are subject to change. The application window for this job posting is expected to end by 06/09/2026.
Equal Opportunity Employer Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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Fort Collins, Colorado, United States

Sprachkenntnisse

English

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