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Packaging Module Equipment Development Engineer
Intel CorporationPhoenix
Job Details: Job Description: Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division focused on next-generation semiconductor packaging solutions. Primary Focus: A
Module Process Equipment Engineer
MetaSunnyvaleAt Meta Reality Labs, we are developing the future of Wearables and Mixed Reality products. This team focuses on developing display and optics technologies for Meta products, creating see-through disp
Package Development, Signal Integrity and Power Integrity Engineer, Staff
Marvell TechnologySanta ClaraAbout MarvellMarvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectu
