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P. Chappel Associates, Inc.
Electronics Packaging Design Engineer
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- United States
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- +1
- United States
À propos
Electronics Packaging Design Engineer
to join our team. In this role, you will lead the design of advanced packaging solutions including flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architectures. You’ll collaborate with cross-functional teams and suppliers to deliver reliable, manufacturable, and cost-effective designs. Responsibilities: Design interconnects, substrate stack-ups, routing strategies, and package layouts. Verify designs against electrical, thermal, mechanical, and manufacturability requirements. Partner with suppliers and internal teams to align designs with process capabilities. Support failure analysis and root-cause investigations. Document design processes and lead reviews from concept to release. Mentor junior engineers and support packaging technology roadmaps.
Compétences idéales
- SIP
Expérience professionnelle
- Hardware
Compétences linguistiques
- English
Avis pour les utilisateurs
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