Retour aux emplois
XX
Hyperscale Data Center Solutions EngineerCorning Inc.Springfield, Missouri, United States
XX

Hyperscale Data Center Solutions Engineer

Corning Inc.
  • US
    Springfield, Missouri, United States
  • US
    Springfield, Missouri, United States

À propos

Corning Inc. is looking for a candidate to drive the adoption of new innovations with major DCBU customers in Illinois. The role involves building deep local relationships with key contacts, providing extensive technical support, and reporting customer feedback to shape future innovations. The ideal applicant should have a relevant degree, technical sales experience, and strong communication skills. The compensation range is between $73,806.00 and $101,483.00, dependent on experience and location.
#J-18808-Ljbffr
  • Springfield, Missouri, United States

Compétences linguistiques

  • English
Avis aux utilisateurs

Cette offre provient d’une plateforme partenaire de TieTalent. Cliquez sur « Postuler maintenant » pour soumettre votre candidature directement sur leur site.