About
The candidate will be a hands-on engineering leader with significant expertise in FEOL/MOL/BEOL patterning processes such as multi patterning etch, conductor/dielectric etch, high aspect ratio etch.
The candidate should also demonstrate strong understanding of industry trends and roadmap in the semiconductor technology.
The position also involves mentoring junior engineers and close collaboration with multi company and cross function engineers from materials, unit process, equipment, integration, layout design, and modeling.
Generation of Intellectual Property for IBM and protection of it through the patenting process are also expected.
Strong analytical and design-of-experiment experience
IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.
Languages
- English
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