Microelectronics EngineerNational Security Agency • Fort Meade, Maryland, United States
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Microelectronics Engineer
National Security Agency
- Fort Meade, Maryland, United States
- Fort Meade, Maryland, United States
About
Microelectronics Engineers utilize electrical, computer, mechanical, and materials engineering knowledge and skills to design, assemble, test, analyze and qualify the next generation of electronics hardware in support of the NSA mission.
The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer, Microelectronics Process Engineer, and Microelectronics Technology Engineer.
1. A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include:
- Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design
- Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL
- Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis
- Understanding and development of assembly specifications in accordance with industry standards
- Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design
- Conduct research including studies, experiments, and investigations on new or alternate methodologies
- Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics
2. A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include:
- Participate in assembly and fabrication process improvement efforts
- Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment
- Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics
3. A Microelectronics Technology Engineer is focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies, and/or system enclosures. Areas of responsibility can also include:
- Conduct environmental and reliability tests
- High-pin-count Integrated Circuit (IC) design and operation validation
- Parametric testing - Accelerated testing / qualification / screening
- Develop test plans according to industry and military specifications
- Design and develop test platforms
- Support quality assurance efforts for developed and fielded systems
- Disassembly and sample preparation for physical analysis of ICs for failure analysis
- Perform scanning electron microscopy (SEM), low energy electrons microscopy (LEEM), and/or atomic force microscopy (AFM)
When submitting your application, please ensure that you fully populate all sections of the resume tool with all relevant skills, experience, and education, as the resume entered into the tool will be the primary resume used to evaluate your application.Please do NOT populate the resume tool with - see resume.
Please attach an unofficial copy of your transcripts from all schools attended when applying for this position. Providing a copy of your transcripts is especially critical to ensure the position's coursework obligations have been met.
Job Summary
As an Engineering and Physical Science professional, you will use your skills to create the systems and tools that will be used to enhance the operation of intelligence. You will advise, administer and perform scientific projects, such as planning, designing, and constructing specialized equipment, and ensuring adherence to sound engineering and scientific standards and principles. The NSA offers multiple areas of focus for facilities engineers, including computer, architectural, electrical, mechanical, and structural. In addition, we are seeking skills that include computer design, microelectronics, radio frequency design, and systems engineering. Apply your science and engineering skills to protect the nation.
When submitting your application, please ensure that you fully populate all sections of the resume tool with all relevant skills, experience, and education, as the resume entered into the tool will be the primary resume used to evaluate your application.Please do NOT populate the resume tool with - see resume.
Please attach an unofficial copy of your transcripts from all schools attended when applying for this position. Providing a copy of your transcripts is especially critical to ensure the position's coursework obligations have been met.
Qualifications
The qualifications listed are the minimum acceptable to be considered for the position.
For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology)
For all of the above degrees, if program is not ABET EAC accredited, it must include specified coursework.*
*Specified coursework includes courses in differential and integral calculus and 5 of the following 18 areas: (a) statics or dynamics, (b) strength of materials/stress-strain relationships, (c) fluid mechanics, hydraulics, (d) thermodynamics, (e) electromagnetic fields, (f) nature and properties of materials/relating particle and aggregate structure to properties, (g) solid state electronics, (h) microprocessor applications, (i) computer systems, (j) signal processing, (k) digital design, (l) systems and control theory, (m) circuits or generalized circuits, (n) communication systems, (o) power systems, (p) computer networks, (q) software development, (r) Any other comparable area of fundamental engineering science or physics, such as optics, heat transfer, or soil mechanics.
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FOR MICROELECTRONICS PACKAGE DESIGN ENGINEER:
Relevant experience must be in one or more of the following: developing advanced microelectronics systems through the design of integrated circuits, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures using electronic design automation (EDA) tools.
FULL PERFORMANCE
With a degree in Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience.
SENIOR
Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered.
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FOR MICROELECTRONICS PROCESS ENGINEER:
Relevant experience must be in one or more of the following: assembly or fabrication process improvement of advanced microelectronics systems such as integrated circuit enclosures, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures.
FULL PERFORMANCE
With a degree in professional Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience.
SENIOR
Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered.
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FOR MICROELECTRONICS TECHNOLOGY ENGINEER:
Relevant experience must be in one or more of the following: characterization, test, reliability, or failure root cause analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures.
FULL PERFORMANCE
With a degree in professional Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience.
SENIOR
Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered.
Competencies
Microelectronics Package Design Engineer Specialized Skills:
- Concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems
- Designing analog and digital circuits (e.g., FPGAs, ASICs, PCBs)
- Use modeling/simulation to evaluate designs
- Experience using Electronic Design Automation (EDA) tools for ASIC and/or PCB design is required
- Applying engineering principles to perform printed circuit board layout
- Applying engineering principles to perform redistribution layer design and layout
- Applying engineering principles to perform 3D integration design and layout
- Application of the scientific principles, methods, and processes used to conduct research studies (e.g., study design, data collection and analysis, and reporting results)
Microelectronics Process Engineer Specialized Skills:
- Concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems is desired
- Understanding of circuit design is desired (e.g., FPGAs, ASICs, PCBs)
- Understanding of modeling/simulation to evaluate designs is desired
- Experience using Electronic Design Automation (EDA) tools is desired
- Applying engineering principles to perform printed circuit board layout is desired
- Application of the scientific principles, methods, and processes used to conduct research studies (e.g., study design, data collection and analysis, and reporting results)
- Semiconductor or integrated circuit quality assurance and materials science/fabrication experience is preferred
Microelectronics Technology Engineer Specialized Skills:
- Concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems
- Understanding of digital circuits designs and schematics (e.g., FPGAs, ASICs)
- Understanding of packaging and/or assembling processes for custom microelectronics (ASICs, FPGAs, PCBs) test and evaluation
- Use modeling/simulation to evaluate microelectronics designs for test
- Testing of integrated circuit devices, FPGAs and complex microelectronics systems
- Microelectronics design engineering including analog or digital logic design is desired.
- Experience using Electronic Design Automation (EDA) tools is desired
- Application of the scientific principles, methods, and processes used to conduct research studies (e.g., study design, data collection and analysis, and reporting results)
- Semiconductor or integrated circuit quality assurance and materials science/fabrication experience is desired
- Develop test plans for environmental and reliability evaluations
- Understanding of industry and military test and reliability standards is desired
Technical competencies for all three positions may include:
- Create and maintain documentation on technical information
- Operate specialized scientific and technical equipment
- Attend conferences and communicate with people in a particular technical field to keep abreast of new technologies and information
- Serve as a subject matter expert to support research and development efforts - Collaborate extensively with customers and develop requirements, project milestones, deliverables and reports
- Research emerging technologies for application(s) within the Agency
- Concepts, theories, and methods related to the composition, structure, and properties of materials, and the identification/processing of optimal materials for various uses
- Solving technical problems
- Translate conceptual designs into technical specifications
- Evaluate information in technical documents to understand its importance and significance
- Work with customers to clarify their needs and to determine how their needs can be met - Semiconductor or integrated circuit quality assurance
- Operate specialized scientific and technical equipment
- Conduct research including studies, experiments, and investigations on new or alternate methodologies
- Conduct research including studies, experiments, and investigations on new or alternate fabrication and assembly/disassembly equipment and analysis tools
- Participate in disassembly and/or physical analysis of microelectronics systems or integrated circuits and contribute to process improvement efforts
- Develop and apply new processes and techniques for the full die imaging and analysis of ICs
- Develop and apply new processes and techniques for full die processing and sample preparation of ICs through the use of polishing/lapping, wet chemistry, plasma etching, thin film coating, and optical metrology tools
- Use microscopy techniques such as scanning electron microscopy (SEM), low energy electron microscopy (LEEM), and/or atomic force microscopy (AFM)
- Develop new techniques and advanced processes for circuit edit, cross sectioning, and imaging for IC's using state of the art focused ion beam tools
- Develop IC failure analysis techniques
The ideal candidate is someone with excellent problem-solving, communication, and interpersonal skills who is:
- Motivated
- Creative
- Able to work effectively across several different functional areas in a collaborative environment
- Well-organized and able to handle multiple assignments
- Customer service and requirements focused
- Detail oriented
Pay, Benefits, & Work Schedule
Pay: Salary offers are based on candidates' education level and years of experience relevant to the position and also take into account information provided by the hiring manager/organization regarding the work level for the position.
Salary Range: $105,262 - $192,764 (Full Performance, Senior)
Salary range varies by location, work level, and relevant experience to the position.
Training will be provided based on the selectee's needs and experience.
Benefits: NSA offers a comprehensive benefits package.
Work Schedule: This is a full-time position, Monday - Friday, with basic 8hr/day work requirement between 6:00 a.m. and 6:00 p.m. (flexible).
DCIPS Trial Period:
If selected for this position, you will be required to serve a two-year DCIPS trial period, unless you are a veterans' preference-eligible employee, in which case you are required to serve a one-year trial period. This trial period runs concurrently with your commitment to the position, if applicable. Before finalizing your appointment at the conclusion of your trial period, NSA will determine whether your continued employment advances the public interest. This decision will be based on factors such as your performance and conduct; the Agency's needs and interests; whether your continued employment would advance the Agency's organizational goals; and whether your continued employment would advance the efficiency of the Federal service.
Upon completion of your trial period, your employment will be terminated unless you receive certification, in writing, that your continued employment advances the public interest.
If you do not receive certification for continued employment, you should receive written notice prior to the end of your trial period that your employment will be terminated and the effective date of such termination.
How to apply
The following four narrative questions provide an opportunity for you to highlight your dedication to public service for the hiring manager and agency leadership (or designee(s)). While your responses are not required and will not be scored, we encourage you to thoughtfully address each question. Please provide a response of 200 words or less to each question. You will be asked to certify that you are using your own words and did not use a consultant or artificial intelligence (AI) such as a large language model (LLM) like ChatGPT or Copilot. (Please attach in application)
1. How has your commitment to the Constitution and the founding principles of the United States inspired you to pursue this role within the Federal government? Provide a concrete example from professional, academic, or personal experience.
2. In this role, how would you use your skills and experience to improve government efficiency and effectiveness? Provide specific examples where you improved processes, reduced costs, or improved outcomes.
3. How would you help advance the President's Executive Orders and policy priorities in this role? Identify one or two relevant Executive Orders or policy initiatives that are significant to you, and explain how you would help implement them if hired.
4. How has a strong work ethic contributed to your professional, academic or personal achievements? Provide one or two specific examples, and explain how those qualities would enable you to serve effectively in this position.
Apply soonest, as job postings can close earlier than stated end dates due to changes in requirements. It is important to review and note the minimum qualifications, as only those applicants who meet the required qualifications will be contacted to continue the employment process. Please populate the resume tool to showcase any relevant work experience and education related to the position and answer any applicable screening questions. Information collected will be used to determine eligibility, and failure to provide accurate information may result in disqualification for this position.
A confirmation email will be sent after submission of the first application and also after any future updates to submitted applications. **Due to time sensitive communications regarding applications, please ensure your spam filters are configured to accept email from noreply@intelligencecareers.gov. For job vacancies that include stated testing requirements, also include the following: @uwe.nsa.gov, @nsa.gov, and @pearson.com**
U.S. Citizenship is required for all applicants. NSA is an equal opportunity employer and abides by applicable employment laws and regulations. All applicants and employees are subject to random drug testing in accordance with Executive Order 12564. Employment is contingent upon successful completion of a security background investigation and polygraph. Reasonable accommodations may be provided to applicants with disabilities during the application and hiring process where appropriate.
DCIPS Disclaimer
**VETERANS AND TRANSITIONING SERVICE MEMBERS**
Thank you for your service! The National Security Agency (NSA) is part of the Defense Civilian Intelligence Personnel System (DCIPS). All positions at NSA are in the Excepted Service under Title 10, United States Codes (U.S.C.), Section 1601 appointment authority.
Veterans' Preference
In accordance with the procedures provided in DoD Instruction 1400.25, Volume 2005, "DoD Civilian Personnel Management System: Defense Civilian Intelligence Personnel System Employment and Placement," NSA applies veterans' preference, as defined by Section 2108 of Title 5, U.S.C., to eligible candidates. If you are claiming veterans' preference, you are required to provide acceptable documentation of your preference eligibility upon application.
Acceptable documentation includes:
- DD-214: "Certificate of Release or Discharge from Active Duty," which shows dates of service and discharge under honorable conditions (Copy 4); OR
- Certification of Service:
A written document on letterhead from the appropriate branch of the armed forces that certifies the service member is expected to be discharged or released from active duty service in the armed forces under honorable conditions not later than 120 days after the date the certification is signed. The certification should include the military service dates, including the expected discharge or release date; AND
- Standard Form 15 (SF-15)
Application for 10-point Veteran Preference (http://www.opm.gov/forms/pdf_fill/sf15.pdf).
If you are claiming a service-connected disability of 30 percent or more, the documentation you provide must specifically demonstrate this level of disability; AND
- VA Letter of Disability (for 10pt and Sole Survivorship rating)
You may obtain a letter from the Department of Veterans Affairs reflecting your level of disability for preference eligibility by visiting a VA Regional Office, contacting a VA call center, or online (https://www.ebenefits.va.gov/).
**Failure to provide sufficient documentation of veterans' preference eligibility may preclude NSA from identifying you as a preference eligible candidate during the hiring selection process.
Languages
- English
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