Senior Silicon Physical Design Engineer
Axelera AI
- Bristol, England, United Kingdom
- Bristol, England, United Kingdom
About
Join to apply for the Senior Engineer - Silicon Physical Design (Italy based) role at Axelera AI. About Us: Axelera AI is not your regular deep‑tech startup. We are creating the next generation AI platform to support anyone who wants to help advancing humanity and improve the world around us. Position Overview
As a Senior Silicon Physical Design Engineer at Axelera AI, you will play a crucial role in developing cutting‑edge multi‑core in‑memory compute SoCs. Leveraging your expertise in ASIC Physical Design from RTL to GDS, you will be responsible for synthesis, floorplanning, place and route, extraction, timing analysis, physical verification, EMIR sign‑off, and formal verification. You will collaborate closely with architecture and RTL teams to ensure successful project execution. Key Responsibilities
Perform synthesis, floorplanning, place and route, extraction, timing analysis, and physical verification. Ensure timing closure, constraint generation, and optimization. Execute clock tree synthesis (CTS) and clock‑building techniques. Integrate IPs including memories, I/Os, embedded processors, DDR, networking fabrics, and analog IPs. Utilize EDA tools such as Primetime, StarRC, Genus, Innovus, Design Compiler, ICC/ICC2, FC, and Calibre. Develop automation scripts in Python, Tcl, or Perl. Debug and solve technical challenges related to physical design. Collaborate with architecture, RTL, and verification teams. Qualifications
10+ years of experience in Physical Design (RTL to GDS). Strong communication and teamwork skills. Expertise in synthesis, timing analysis, and timing closure. Hands‑on experience with leading EDA tools (Primetime, StarRC, Genus, Innovus, Design Compiler, ICC/ICC2, FC, Redhawk, and Calibre). Proficiency in clocking techniques and CTS. Experience in IP integration across various domains. Strong scripting skills (Python, Tcl, or Perl). Proven problem‑solving and debugging capabilities. Fluent in English (spoken and written). Italian not required. Highly preferred
Experience in top‑level integration and I/O ring design. Knowledge of chip‑package‑board co‑simulation and packaging. Ability to influence design methodologies and tool flows. Experience working with EDA vendors to resolve tool issues. Understanding of semiconductor device physics and multi‑domain design. Location
This position is based Italy (in hybrid or remote set up). We also support relocation to Bologna, Florence or Milan for talent based abroad and interested in this role. What We Offer
This is your chance to shape and be part of a dynamic, fast‑growing, international organization. We offer an attractive compensation package, including a pension plan, extensive employee insurances and the option to get company shares. An open culture that supports creativity and continual innovation is awaiting you. Collaborative ownership and freedom with responsibility is characteristic for the way we act and work as a team. At Axelera AI, we wholeheartedly embrace equal opportunity and hold diversity in the highest regard. Our steadfast commitment is to cultivate a warm and inclusive environment that empowers and celebrates every member of our team. We welcome applicants from all backgrounds to join us in shaping the future of AI.
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Languages
- English
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