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Global Head of Embedded Electronics EngineeringCintal Inc • United States
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Global Head of Embedded Electronics Engineering

Cintal Inc
  • US
    United States
  • US
    United States
Apply Now

About

Cintal is a forward-thinking global technology company that develops and provides cutting-edge products and services to various industries such as heavy equipment, industrial, defense, agriculture, and medical. With our dedicated team of experienced technical professionals, Cintal aims to add value for its customers by leveraging advanced technologies to reduce product costs, shorten design and development lead times, and accelerate the introduction of high-quality products to the market.
LOCATION:
Hybrid
India - Chennai or Bangalore or willing to relocate
US - Peoria, IL area or willing to relocate
COMPENSATION & PERFORMANCE INCENTIVE:
Compensation for this role is competitive and will be commensurate with experience, domain expertise, and geographic location.
The compensation package includes:
Base Salary:
Determined based on location, years of experience, and demonstrated P&L leadership. Performance-Based Bonus:
Significant annual incentive opportunity tied directly to: Revenue growth within the Manufacturing Engineering vertical Gross margin expansion Overall business performance and strategic growth milestones
This role is designed for a business builder. Incentive earnings increase meaningfully with vertical revenue growth and sustained margin performance.
BENEFITS:
Benefits are competitive and vary by country and local market requirements. Comprehensive benefits packages may include:
Health, dental, and vision coverage (where applicable) Retirement contributions Paid time off and holidays in accordance with local standards Life and disability insurance (location dependent) Professional development and leadership growth opportunities Travel reimbursement and business-related expenses Specific benefit details will be shared during the interview process based on the candidate's work location.
JOB DESCRIPTION/TYPICAL TASK BREAKDOWN:
We are seeking a highly experienced Global Head of Embedded Engineering to lead the strategy, growth, and global delivery of embedded systems and advanced electronics engineering services.
This executive leadership role owns the full P&L of the Embedded Engineering vertical and will lead global teams delivering complex hardware and software systems for connected products, industrial electronics, and advanced embedded platforms.
The ideal candidate will combine deep technical expertise in embedded systems with strong leadership and commercial experience to scale global engineering operations and expand strategic customer partnerships.
DUTIES & RESPONSIBILITIES:
Strategic Leadership
Define the global strategy for embedded systems engineering services Expand embedded hardware, firmware, and software capabilities Drive innovation in connected products and advanced electronics Full P&L Responsibility
Own revenue growth, margin performance, and operational efficiency Manage budgeting, forecasting, and financial performance Global Customer Leadership
Develop executive relationships with international customers Lead proposals, pricing discussions, and commercial negotiations Support customer product development programs Global Delivery Management
Lead global embedded engineering teams Ensure high-quality delivery of hardware and firmware programs Establish scalable development and validation frameworks Technical Leadership
Provide subject matter leadership across:
Embedded hardware architecture Firmware development and real-time systems Embedded Linux and RTOS environments Electronics design and validation System integration and product development Travel • Domestic and international travel is required to support customers and global teams.
EDUCATION & EXPERIENCE: •
Master's degree+
in Embedded Systems Engineering, Electrical Engineering, Electronics Engineering, Computer Engineering, or related field. •
15-25 years of experience
in one or more of the following industries (mandatory):
o Heavy engineering
o Earth moving equipment
o Automotive
o Industrial equipment •
Leadership Competencies:
o Strategic thinker with entrepreneurial mindset
o Strong commercial acumen
o Excellent communication and stakeholder management skills
o Ability to operate in a global matrix organization
o High emotional intelligence and cultural awareness • Proven experience managing large, multi-location engineering teams • Significant international customer interaction experience • Demonstrated P&L or revenue responsibility • Strong executive presence and leadership maturity
REQUIRED TECHNICAL SKILLS: • Deep expertise in Embedded Electronics Engineering • Embedded hardware design (analog/digital, PCB design, power management) • Microcontrollers, SoCs, RTOS, Linux-based systems • Firmware architecture and C/C++ development • Communication protocols (CAN, SPI, I2C, Ethernet, BLE, Wi-Fi, etc.) • Knowledge of global embedded electronics standards and compliance
Required Systems & Digital Embedded Knowledge
ERP systems (SAP, Oracle, or equivalent) PLM systems (Teamcenter, Windchill, or similar) Advanced Excel & data-driven decision making KPI dashboards and performance analytics Embedded C/C++ best practices Memory management in constrained systems Bootloaders and secure startup sequences Board Support Package (BSP) architecture Driver development Middleware integration Over-the-air update architectures
DESIRED SKILLS: • Advanced System Architecture Expertise • High-Performance Digital & Processing Systems • Functional Safety & Compliance Leadership • Embedded Cybersecurity Expertise • Digital Engineering & Automation • Connectivity & Edge Integration • Reliability & Robustness Engineering • Innovation & Emerging Technology Acumen • Technical Due Diligence & Executive Advisory Capability
We are committed to building a diverse, inclusive, and global team. Candidates must be authorized to work in the United States. We are pleased to offer visa sponsorship for eligible and qualified individuals.
Cintal provides equal employment opportunities to all employees and applicants for employment without regard to race, color, creed, ancestry, national origin, citizenship, sex or gender (including pregnancy, childbirth, and pregnancy-related conditions), gender identity or expression (including transgender status), sexual orientation, marital status, religion, age, disability, genetic information, service in the military, or any other characteristic protected by applicable federal, state, or local laws and ordinances. Equal employment opportunities apply to all terms and conditions of employment, including hiring, placement, promotion, termination, layoff, recall, transfer, leave of absence, compensation, and training.
  • United States

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