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Packaging Design Engineer — 2.5D/3D IC, EquityGoogle Inc. • San Diego, California, United States
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Packaging Design Engineer — 2.5D/3D IC, Equity

Google Inc.
  • US
    San Diego, California, United States
  • US
    San Diego, California, United States
Jetzt Bewerben

Über

Google Inc. is seeking an experienced engineer to focus on chip package substrate design for mobile SOC packages. You will be part of a team driving innovation in silicon solutions, impacting products for millions globally. The role requires significant collaboration across engineering disciplines and includes responsibilities such as defining design strategies and interfacing with suppliers. Competitive salary and benefits, including a bonus target, are offered.
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  • San Diego, California, United States

Sprachkenntnisse

  • English
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