S'INSCRIRE
Retour aux emplois
XX
SI/PI for 3DIC Sr Principle Solutions EngineerCadence • Cary, North Carolina, United States
Trouver des emplois similaires

Cette offre d'emploi n'est plus disponible

XX

SI/PI for 3DIC Sr Principle Solutions Engineer

Cadence
  • US
    Cary, North Carolina, United States
  • US
    Cary, North Carolina, United States
Trouver des emplois similaires

À propos

At Cadence , we hire and develop leaders and innovators who want to make an impact on the world of technology. This position involves defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions. Location: remote role but must be located in the US.
Responsibilities
Demonstrate expert knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power design, signal integrity, power integrity and definition of electrical constraints.
Apply design experience and industry knowledge of one of Signal, Power, and Thermal analysis associated with IC, package, or PCB design.
Analyze the customer's environment and evaluate appropriate solutions; be knowledgeable of competitive technologies.
Anticipate technical issues and develop creative solutions before they become problems; take technical lead on a wide range of projects.
Understand high-speed, high-performance signal and power integrity-related issues and collaborate with peers and other business groups.
Communicate effectively with Cadence R&D, Product Engineering, Marketing and with customers; understand customer success criteria and commit to ensuring customer success.
Qualifications
Bachelor’s degree (Master’s preferred) in Electrical or Electronics Engineering
Minimum 15 years of experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design
5+ years of experience with Cadence SI/PI tools Allegro platform tools including: Sigrity, Clarity, PCB Editor; ICP preferred
Strong knowledge of advanced packaging concepts
Strong knowledge of 2.5D, 3DIC and stacked die technologies
Understanding of chip-level CMOS design concepts desired
Strong customer-facing communication and problem-solving skills
Strong personal drive for continuous learning and expanding professional skill sets
Excellent verbal and written communication skills
Compensation and Benefits The annual salary range for California is $143,500 to $266,500. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include paid vacation and holidays, 401(k) with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.
About Cadence We’re doing work that matters. Help us solve what others can’t.
#J-18808-Ljbffr
  • Cary, North Carolina, United States

Compétences linguistiques

  • English
Avis aux utilisateurs

Cette offre a été publiée par l’un de nos partenaires. Vous pouvez consulter l’offre originale ici.

Trouver des emplois similaires